Full Contact Enhanced Performance
Patented DirectCompress™ Soldering, increases the actual contact surface between the heatpipe and heatsink fins. DirectCompress™ Soldering has up to 10% more contact surface compared to traditional soldering, and the more contact surface the faster the heat conduction.
Spreading Out and Making Room
On aluminum sheets, heat spreads out in a radial direction. By displacing the heatpipe alignment on the heatsink fins, our Heatsink Displacement Optimization™ allows for better and more evenly spread heat conduction on the fins compared to traditional linear alignment.
Accelerated Air Exhaust The Faster the Cooler
The individual tower stack is separated into two sections, the loose air intake and the high density exhaust section. By the laws of fluid dynamics, the increase in fin count in the exhaust section squeezes airflow and increases exhaust air speed. The increase of airflow speed in our Jet Fin Acceleration System™ allows heated air leave the tower faster.
Optimized Heatpipe Positioning Total CPU Coverage
The R1’s Heatpipe Convex-Align™ System allows for more heatpipes in a given area, optimized heatpipe placement in the copper base, and improved alignment with your CPU. With the Heatpipe Convex-Align™ System, each heatpipe functions to their maximum TDP capacity.
Kill the Noise Silence is Cold
Acoustics are just as important as performance. That’s why the XF140 140mm fan integrates acoustic optimizations. The XF140 features our High Precision Low Noise (HPLN™) Bearing and the detachable Acoustic Vibration Absorbers that give the fan a snugger fit while canceling vibration and noise at the same time.
Unmatched Compatibility Zero RAM Interference
Focusing on providing the widest range of compatibility, the R1 utilizes an asymmetric slanted heatpipe layout to move the front heatsink fin stack further away from the RAM zone. Also, fitted with a 13mm thin XT140 the CRYORIG R1 offers optimal compatibility for RAM with tall heat spreaders on both Intel (115X/1366/775) and AMD platforms.
Small Boards Tall RAM? Universal Means Compatible!
The R1 Universal is made to fit with high-end tall RAM, even on smaller ITX boards. RAM tolerance is virtually unlimited!
- Dimension ( with fan ): L128.5 mm x W140 mm x H168.3 mm
- Weight ( with fan ): 1215 g
- Weight ( without fan ): 970 g
- Heat pipes: 6mm heatpipe x 7 units
- Front Fin: T = 0.4 mm ; Gap = 2.4 mm
- Front Fin Pcs: 42 pcs
- Rear Fin: T = 0.4 mm ; Gap = 1.8 mm
- Rear Fin Pcs: 53 pcs
- Copper Base: C1100 Pure copper nickel plated
- Distance From Center: 35.5 mm
- RAM Height Limit: Limitless
- TDP: 240 W+
- Dimension:L140 mm x W140 mm x H13 mm
- Weight: 89 g
- Rated Speed: 700 ~ 1300 RPM ±10 %
- Noise Level: 20 ~ 24 dBA
- Air Flow: 65 CFM
- Air Pressure: 1.49 mmH2O
- Ampere: 0.27 A